The project aims to design and manufacture an innovative multilevel power electronics module based on SiC devices. MuSiCa will demonstrate significant advances in performances as well as in the Technology Readiness Level (TRL) in the manufacturing of advanced power modules.
Maximise the performance of SiC power semiconductor devices
Improved design of power module and gate driver to minimise parasitic inductance
optimize thermal integration and heat dissipation
minimise conduction and switching
losses and to realise the full benefits of SiC devices for the application
Increased modularity and scalability
Improvement in power module internal layout design and external package design and
design of power terminals for easier integration in the aircraft electronics system
Choice of component materials and silicon carbide devices in the power module to
facilitate scaling up/down of power rating
Increased manufacturability
Processes and techniques aimed at enhancing repeatability and
reproducibility
Increased throughput and yield thereby reducing manufacturing time
and costs
Increased preparedness of supply chain, in an existing manufacturing
production line